EPIR fabricates custom infrared FPAs, offering HgCdTe FPAs on both CdZnTe and lower-cost Si substrates.
Formats: 320 x 256 | 640 x 512
Pixel Pitches: 30 µm | 15 µm
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Readout integrated circuits (ROICs)
ISC9705 ROIC for 320 x 256 format, and 30 µm pitch
ISC9809 ROIC for 320 x 256 format, and 30 µm pitch
ISC0403 ROIC for 640 x 512 format, and 15 µm pitch
Customers may also use their own ROICs -
Material Structures
HgCdTe/CdZnTe (High Performance)
HgCdTe/Si (Low-Cost) -
Spectral Ranges
eSWIR 1.0 µm - 2.7 µm
MWIR 3.0 µm - 5.5 µm
LWIR 8.0 µm - 13.0 µm
Custom ranges are available.
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Quantum Efficiency
Over 70%
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Standard Packaging
84 Pin Leadless Chip Carrier (Wire Bonded)
- Customized Packaging available upon request